International collaboration EU and Japan on semiconductors
EU-Japan collaboration on advanced semiconductor integration and chiplet standardization for AI applications.
This call supports projects advancing semiconductor technologies like 2.5D/3D packaging and integrated photonics. It aims to standardize chiplet interfaces to boost interoperability and industry growth. Projects should demonstrate solutions at pilot scale and promote knowledge sharing through workshops and publications.
Likely relevant for
- Semiconductor technology developers
- AI hardware innovators
- Integrated photonics researchers
- Chiplet ecosystem developers
- European and Japanese industry stakeholders
Project signals
What it funds
- Advanced heterogeneous integration in 2.5D and 3D packaging
- Integrated photonics supporting AI functionalities
- Standardised chiplet interfaces for interoperability
- Solutions validated in laboratory and pilot semiconductor manufacturing environments
Expected outcomes
- Immediate impact on European semiconductor industry
- Development of a dynamic chiplet ecosystem
- Knowledge transfer and stakeholder engagement through workshops, publications, and networking events
Who can apply / participate
- Research organizations
- Industry partners
- SMEs
- Consortia including European and Japanese participants
- Check Appendix 8 of Work Programme for consortium composition rules
- Eligible countries as per Appendix 8 of Work Programme - Chips for Europe Initiative
- Admissibility conditions including proposal page limits and layout
- Financial and operational capacity requirements
- Evaluation and award criteria detailed in Appendix 8
- Specific country eligibility details
- Exact consortium size and composition requirements
Must check before shortlisting
- Eligibility criteria in Appendix 8 of Work Programme - Chips for Europe Initiative
- Country eligibility and consortium requirements
- Proposal page limits and layout as per application form
- Financial and operational capacity requirements
Money
Total budget up to €5,000,000 for 2026 with expected grants between €3,000,000 and €5,000,000 each.
- Maximum contribution per grant — 5000000EURExpected grants between €3M and €5M each.
Application notes
- Single-stage submission model.
- Proposal page limits and layout as per Appendix 8 of Work Programme and application form.
- Eligibility conditions detailed in Appendix 8 of Work Programme - Chips for Europe Initiative.
- Financial and operational capacity requirements as per Appendix 8.
- Evaluation and award criteria and process described in Appendix 8 and Online Manual.
- Legal and financial set-up of grants described in Appendix 8.
- Prepare proposal following page limits and layout guidelines.
- Ensure eligibility according to Appendix 8 of Work Programme.
- Submit proposal via Funding & Tenders Portal before deadline.
- Participate in evaluation process as described in call documents.
- Check Appendix 8 of Work Programme for detailed eligibility and evaluation criteria.
- Verify country and consortium eligibility before applying.
- Follow all formatting and submission guidelines strictly to avoid inadmissibility.
Derived from official EU Funding portal source · updated 7 Jul 2026, 12:10 UTC. Use this as a shortlisting aid; the official call text remains authoritative.
Official source text
Fine print from the EU source record. Expand when you need the original wording.
Topic description
Expected Outcome: Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry. Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.
Conditions and documents
Conditions
1. Admissibility conditions: Proposal page limit and layout
described in Appendix 8 of Work Programme - Chips for Europe Initiative call document.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.
2. Eligible countries
3. Other eligibility conditions
4. Financial and operational capacity and exclusion
5a. Evaluation and award: Submission and evaluation processes
described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual.
5b. Evaluation and award: Award criteria, scoring and thresholds
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
6. Legal and financial set-up of the grants
Call document and annexes:
Model Grant Agreements (MGA)
Additional documents:
Support information
For help related to this call, please contact: Calls@chips-ju.europa.eu Funding & Tenders Portal FAQ – Submission of proposals . IT Helpdesk – Contact the IT helpdesk for questions such as forgotten passwords, access rights and roles, technical aspects of submission of proposals, etc. Online Manual – Step-by-step online guide through the Portal processes from proposal preparation and evaluation to reporting on your ongoing project. Valid for all 2021-2027 programmes.
Raw budget overview
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