Funding-call technology
Semiconductors EU funding calls
Open and forthcoming EU funding calls connected to Semiconductors through the funding knowledge graph. Use this as a screening view for calls that may be relevant and worth reviewing; official call pages remain authoritative.
32 graph-linked callstechnology:semiconductors
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Technology calls
Calls connected to this technology
HORIZON-CL3-2026-02-CS-ECCC-01•open for submission
Approaches and tools for security in software and hardware development and assessmentProgramme: Horizon Europe (HORIZON)Action type: HORIZON Research and Innovation ActionsDeadline: 15 Sep 2026
HORIZON-CL4-2026-SPACE-03-81•open for submission
Space critical EEE components for EU non-dependence – Radiation Hard FPGA on 7nmProgramme: Horizon Europe (HORIZON)Action type: HORIZON Research and Innovation ActionsDeadline: 16 Sep 2026
HORIZON-CL4-2026-SPACE-03-82•open for submission
Space critical EEE components for EU non-dependence – GaN MMICs mm-Wave Foundations (Phase A): Development and Industrialization of Semi-insulating SiC Substrate CapabilitiesProgramme: Horizon Europe (HORIZON)Action type: HORIZON Research and Innovation ActionsDeadline: 16 Sep 2026
HORIZON-JU-CHIPS-2026-2-RIA•open for submission
RIA Resilience call reinforcing Europe's strength in 6G radio communication systemsProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Research and Innovation ActionsDeadline: 16 Sep 2026
HORIZON-JU-CHIPS-2026-3-RIA•open for submission
Call with Digital Partnership and TTC countriesProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Research and Innovation ActionsDeadline: 16 Sep 2026
HORIZON-JU-CHIPS-2026-FT1-IA•open for submission
IA Resilience call reinforcing Europe's strenght in power electronicsProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Innovation ActionsDeadline: 16 Sep 2026
HORIZON-JU-CHIPS-2026-FT2-IA•open for submission
IA Resilience call reinforcing Europe's strength in photonicsProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Innovation ActionsDeadline: 16 Sep 2026
HORIZON-JU-CHIPS-2026-FT3-IA•open for submission
IA Resilience call reinforcing Europe's strenght in healthProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Innovation ActionsDeadline: 16 Sep 2026
HORIZON-JU-CHIPS-2026-2-CSA•open for submission
Supply chain resilience CSAProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Coordination and Support ActionsDeadline: 22 Sep 2026
HORIZON-JU-CHIPS-2026-SDV-CSA•open for submission
Coordination of the European software-defined vehicle platformProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Coordination and Support ActionsDeadline: 22 Sep 2026
DIGITAL-JU-CHIPS-2026-SG-JAPAN•open for submission
International collaboration EU and Japan on semiconductorsProgramme: Digital Europe Programme (DIGITAL)Action type: DIGITAL JU Simple GrantsDeadline: 24 Sep 2026
DIGITAL-JU-CHIPS-2026-SKILLS-HOE-SG•open for submission
Skills Hubs of Excellence Programme: Digital Europe Programme (DIGITAL)Action type: DIGITAL JU Simple GrantsDeadline: 24 Sep 2026
DIGITAL-JU-CHIPS-2026-SKILLS-PF-SG•open for submission
Pilot Federation Programme: Digital Europe Programme (DIGITAL)Action type: DIGITAL JU Simple GrantsDeadline: 24 Sep 2026
DIGITAL-JU-CHIPS-2026-SKILLS-SCD-CSA•open for submission
Stimulation of Chip Design Programme: Digital Europe Programme (DIGITAL)Action type: DIGITAL JU Coordination and Support ActionsDeadline: 24 Sep 2026
HORIZON-JU-EUROHPC-2026-PQC-06-01•open for submission
Large-Scale Photonic Quantum Computing Platform TechnologiesProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Research and Innovation ActionsDeadline: 30 Sep 2026
HORIZON-JU-CHIPS-2026-IMAF-CSA•open for submission
Impact Monitoring and Assessment Framework for the Chips JUProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Coordination and Support ActionsDeadline: 30 Sep 2026
DIGITAL-JU-CHIPS-2026-AI-GFP•open for submission
AI compute evaluation and deployment platform for EU infrastructureProgramme: Digital Europe Programme (DIGITAL)Action type: DIGITAL JU Grants for ProcurementDeadline: 27 Oct 2026
DIGITAL-JU-CHIPS-2026-AI1-SG•open for submission
AI chip demonstrators for EU compute infrastructureProgramme: Digital Europe Programme (DIGITAL)Action type: DIGITAL JU Simple GrantsDeadline: 27 Oct 2026
HORIZON-JU-EUROHPC-2026-NAPT-11-01•open for submission
Neutral-Atom Platform TechnologiesProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Research and Innovation ActionsDeadline: 17 Nov 2026
HORIZON-JU-EUROHPC-2026-QEXP-14-01•open for submission
Quantum Experimental Pilot Lines for Quantum TechnologiesProgramme: Horizon Europe (HORIZON)Action type: HORIZON JU Research and Innovation ActionsDeadline: 17 Nov 2026
HORIZON-EIC-2026-STEP•open for submission
EIC STEP Scale UpProgramme: Horizon Europe (HORIZON)Action type: HORIZON EIC Equity OnlyDeadline: 25 Nov 2026
EDF-EDIP-P-2027-LS-IRA-KEC•open for submission
Key electronic componentsProgramme: European Defence Fund (EDF)Action type: EDF Lump Sum GrantsDeadline: 16 Feb 2027
HORIZON-WIDERA-2027-05-ERA-05•forthcoming
Pillar IV: Upgrading the EU’s independent knowledge on China's Science, Technology and Innovation systemProgramme: Horizon Europe (HORIZON)Action type: HORIZON Research and Innovation ActionsDeadline: 11 Mar 2027
HORIZON-CL4-2027-04-DATA-09•forthcoming
Energy efficiency and sustainability of AI data processing in Data Centres (IA)Programme: Horizon Europe (HORIZON)Action type: HORIZON Innovation ActionsDeadline: 18 Mar 2027
HORIZON-CL4-2027-04-DIGITAL-EMERGING-04•forthcoming
Apply AI: Challenge-Driven AI Innovation Booster in Apply AI prioritised sectors (RIA) (Partnership in AI, Data and Robotics)Programme: Horizon Europe (HORIZON)Action type: HORIZON Research and Innovation ActionsDeadline: 18 Mar 2027
HORIZON-CL4-2027-04-DIGITAL-EMERGING-05•forthcoming
Apply AI: AI-Driven Robotics for Industry: Enabling System Integration and Adoption (IA) (Partnership in AI, Data and Robotics)Programme: Horizon Europe (HORIZON)Action type: HORIZON Innovation ActionsDeadline: 18 Mar 2027
HORIZON-CL4-2027-04-DIGITAL-EMERGING-06•forthcoming
International cooperation in AI (IA)Programme: Horizon Europe (HORIZON)Action type: HORIZON Innovation ActionsDeadline: 18 Mar 2027
HORIZON-CL4-2027-04-DIGITAL-EMERGING-10•forthcoming
Horizon scanning and foresight in future enabling digital technologies (CSA)Programme: Horizon Europe (HORIZON)Action type: HORIZON Coordination and Support ActionsDeadline: 18 Mar 2027
HORIZON-CL4-2027-04-DIGITAL-EMERGING-11•forthcoming
EU Frontier AI Initiative: Developing frontier AI solutions that are safe and computationally efficient within Apply AI (RIA)Programme: Horizon Europe (HORIZON)Action type: HORIZON Research and Innovation ActionsDeadline: 18 Mar 2027
HORIZON-CL4-2027-04-HUMAN-01•forthcoming
Advanced and Innovative hardware components for Virtual Worlds (RIA) (Virtual Worlds Partnership)Programme: Horizon Europe (HORIZON)Action type: HORIZON Research and Innovation ActionsDeadline: 18 Mar 2027
HORIZON-CL4-2027-05-DIGITAL-EMERGING-03•forthcoming
Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)Programme: Horizon Europe (HORIZON)Action type: HORIZON Research and Innovation ActionsDeadline: 18 Mar 2027
HORIZON-INFRA-2027-SERV-01-02•forthcoming
Access to research infrastructure services to enable R&I addressing EU priorities and emerging challengesProgramme: Horizon Europe (HORIZON)Action type: HORIZON Research and Innovation ActionsDeadline: 15 Jun 2027
Associated technology areas
Also appears on some of the same current calls
These are screening links only, based on graph co-occurrence across the current open and forthcoming calls connected to Semiconductors.
44% overlap•14 shared calls
Artificial intelligenceAlso appears on 14 of the same current calls.
44% overlap•14 shared calls
Quantum technologiesAlso appears on 14 of the same current calls.
25% overlap•8 shared calls
RoboticsAlso appears on 8 of the same current calls.
13% overlap•4 shared calls
CybersecurityAlso appears on 4 of the same current calls.
6% overlap•2 shared calls
Battery technologiesAlso appears on 2 of the same current calls.
6% overlap•2 shared calls
Digital twinsAlso appears on 2 of the same current calls.