Supply chain resilience CSA
Support creation of a secure digital twin platform for EU semiconductor supply chain resilience and risk management.
This call funds a project to build a secure data platform representing the EU semiconductor supply chain. It will gather anonymized data from companies, map supply chain capabilities, and conduct risk analysis. The platform will provide early warnings to help prevent crises in the semiconductor sector.
Likely relevant for
- Semiconductor industry stakeholders
- Data platform developers
- Supply chain risk analysts
- Research organizations in electronics and digital technologies
- Policy and crisis management experts
Project signals
What it funds
- Development of a secure, anonymized data platform as a digital twin of the semiconductor supply chain
- Data gathering from upstream and downstream companies
- Use or integration of existing digital references based on semantic web technologies
- Management by a trusted intermediary on secure infrastructure, possibly using Multi-Party Computation
- Global mapping of semiconductor value chain capabilities and products
- Conducting stress tests and risk analysis of the EU semiconductor supply chain
- Issuing early warnings and recommendations to the Commission and Member States
Expected outcomes
- A functional supply chain data platform providing access to company-specific and aggregate anonymized data
- Comprehensive mapping of semiconductor value chain and supply chain relationships
- Risk analysis reports and stress test results
- Early warning system to prevent semiconductor supply chain crises
Who can apply / participate
- Research organizations
- Industry associations
- SMEs and large companies in semiconductor and related sectors
- Public bodies and trusted intermediaries
- Single-stage submission
- Consortium composition and eligibility as per Appendix 7 to the Work Programme - ECS 2026
- Eligible countries as described in Appendix 7 to the Work Programme - ECS 2026
- Check Appendix 7 to the Work Programme - ECS 2026 for detailed eligibility conditions
- Specific consortium size or composition requirements
Must check before shortlisting
- Eligibility conditions in Appendix 7 to the Work Programme - ECS 2026
- Consortium composition and funding rules
- Technical feasibility of proposed digital twin platform
Money
Total budget up to €2,000,000 for 2026 with expected 1 grant awarded.
- Maximum EU contribution — 2000000EURMaximum funding for one grant in 2026
Application notes
- Single-stage submission model.
- Proposal page limits and layout as per Appendix 7 to the Work Programme - ECS 2026 and Application Form Part B.
- Eligibility and admissibility conditions detailed in Appendix 7 to the Work Programme - ECS 2026.
- Financial and operational capacity requirements as per Appendix 7 to the Work Programme - ECS 2026.
- Evaluation criteria and award process described in Appendix 7 to the Work Programme - ECS 2026.
- Legal and financial set-up as per Appendix 7 and Annex G of the Work Programme.
- Prepare proposal following guidelines in Appendix 7 to the Work Programme - ECS 2026.
- Submit proposal via the Funding & Tenders Portal before deadline.
- Ensure compliance with eligibility and admissibility criteria.
- Follow evaluation and award procedures as described.
- Check specific topic conditions in the Work Programme.
- Verify eligibility of participants and countries.
- Ensure proposal meets page limits and formatting requirements.
Derived from official EU Funding portal source · updated 7 Jul 2026, 12:19 UTC. Use this as a shortlisting aid; the official call text remains authoritative.
Official source text
Fine print from the EU source record. Expand when you need the original wording.
Topic description
Expected Outcome: The action should establish a supply chain data platform, as a digital twin of the semiconductor supply chain, which should: • Gather secure, anonymized data shared by companies, coming from both upstream and downstream industries. • Possibly make use of an existing digital reference14 of the semiconductor supply chain (based on semantic web technologies). • Be managed by a trusted intermediary and hosted on a trusted data sharing infrastructure (potentially leveraging secure Multi-Party Computation). • Provide access to each participating company (providing its data) to its own data and aggregate anonymised data. The action should support the data gathering from the companies involved. The action should support a global mapping of the semiconductor value chain, as regards to the capabilities and the products of each main company and its supply chain relationships. The action should also support conducting stress tests of the supply chain and develop risk analysis of the EU semiconductor supply chain. Finally, the action needs to support issuing early warnings and recommendations for proactive measures to the Commission and Member States to avoid any potential crisis activation according to Article 23 of the Chips Act.
Conditions and documents
General conditions
1. Admissibility conditions: Proposal page limit and layout
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.
2. Eligible countries
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
A number of non-EU/non-Associated Countries that are not automatically eligible for funding have made specific provisions for making funding available for their participants in Horizon Europe projects. See the information in the Horizon Europe Programme Guide.
3. Other Eligibility Conditions
4. Financial and operational capacity and exclusion
5a. Evaluation and award: Award criteria, scoring and thresholds
5b. Evaluation and award: Submission and evaluation processes
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
6. Legal and financial set-up of the grants
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 and in the Annex G of the Work Programme General Annexes.
Specific conditions
described in the [specific topic of the Work Programme]
Application and evaluation forms and model grant agreement (MGA):
Guidance
Model Grant Agreements (MGA)
Call-specific instructions
Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026
Additional documents:
Support information
For any questions related to this call please contact : Calls@chips-ju.europa.eu Online Manual is your guide on the procedures from proposal submission to managing your grant. Horizon Europe Programme Guide contains the detailed guidance to the structure, budget and political priorities of Horizon Europe. Funding & Tenders Portal FAQ – find the answers to most frequently asked questions on submission of proposals, evaluation and grant management. Research Enquiry Service – ask questions about any aspect of European research in general and the EU Research Framework Programmes in particular. National Contact Points (NCPs) – get guidance, practical information and assistance on participation in Horizon Europe. There are also NCPs in many non-EU and non-associated countries (‘third-countries’). IT Helpdesk – contact the Funding & Tenders Portal IT helpdesk for questions such as forgotten passwords, access rights and roles, technical aspects of submission of proposals, etc. European IPR Helpdesk assists you on intellectual property issues. CEN-CENELEC Research Helpdesk and ETSI Research Helpdesk – the European Standards Organisations advise you how to tackle standardisation in your project proposal. The European Charter for Researchers and the Code of Conduct for their recruitment – consult the general principles and requirements specifying the roles, responsibilities and entitlements of researchers, employers and funders of researchers. Partner Search help you find a partner organisation for your proposal.
Raw budget overview
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