RIA Resilience call reinforcing Europe's strength in 6G radio communication systems
RIA call to develop key microelectronics building blocks for 6G FR3 front-end modules, advancing European telecom tech.
This call funds research on microelectronics components for 6G radio systems, focusing on front-end modules (FEM) at FR3 frequencies. Projects should improve performance, energy efficiency, and integration of FEM technologies. Collaboration with pilot lines and pre-industrialisation plans are encouraged.
Likely relevant for
- Telecommunications technology developers
- Microelectronics researchers
- 6G system designers
- RF front-end module manufacturers
- Semiconductor technology developers
Project signals
What it funds
- Design, specification, implementation, and testing of microelectronics building blocks for FR3 front-end modules (FEM)
- Advancement of FEM integration including computing, RF, power generation, and beamforming technologies
- Development of semiconductor technologies with PDK and EDA support
- Enabling spectrum sharing, large array integration, broadband RF transceivers, and full-duplex capabilities
- Support for integrated sensing and communications (ISAC) functionalities
- Packaging and system integration of FEM modules
- Stimulating European ecosystem of microelectronic suppliers for telecom industry
Expected outcomes
- Optimized cost-performance FEM meeting ITU IMT 2030 specs with 50% energy savings
- Operational spectrum sharing within FR3 sub-band
- Compact, low power, high efficiency FEM integration with large arrays
- High bandwidth carrier aggregation support
- Sub-band full-duplex for uplink coverage extension
- ISAC supporting radar and interference management
- Advances in design tools and PDKs
- Strengthened European microelectronics supply ecosystem
Who can apply / participate
- Research organisations
- Industry players in microelectronics and telecom
- SMEs and large enterprises
- Universities and technical institutes
- Collaboration with relevant Pilot Lines encouraged
- Consortium composition and eligibility detailed in Appendix 7 of Chips JU Workprogramme
- Eligible countries as per Chips JU Workprogramme Appendix 7
- Refer to Appendix 7 of Chips JU Workprogramme for detailed eligibility
- General and specific conditions apply as per call documents
- Exact consortium size and composition requirements
- Specific country eligibility details
Must check before shortlisting
- Eligibility criteria in Appendix 7 of Chips JU Workprogramme
- Consortium requirements and country eligibility
- Budget limits and funding conditions
Money
Total budget up to €20 million for 2026 with one expected grant between €1 million and €20 million.
- Total budget — 20000000EURMaximum contribution for the call in 2026
Application notes
- Single-stage submission model.
- Proposal page limits and layout detailed in Part B of Application Form
- Refer to Appendix 7 of Chips JU Workprogramme for eligibility and conditions
- Required documents include Guide for Applicants, Evaluation Form, Application Form Part B, Ownership Control Declaration, National Budgets Table
- General documents include Multiannual Work Programme, ECS Strategic Research and Innovation Agenda, Model Grant Agreement
- Additional documents include EU Financial Regulation 2024/2509 and Funding & Tenders Portal manuals
- Prepare proposal according to Part B Application Form and call documents
- Submit proposal via Funding & Tenders Portal before deadline
- Ensure compliance with eligibility and admissibility conditions
- Consult Guide for Applicants and Horizon Europe Programme Guide for detailed instructions
- Check eligibility criteria carefully in Appendix 7
- Follow page limits and formatting strictly
- Collaboration with Pilot Lines is encouraged but not mandatory
Derived from official EU Funding portal source · updated 7 Jul 2026, 12:20 UTC. Use this as a shortlisting aid; the official call text remains authoritative.
Official source text
Fine print from the EU source record. Expand when you need the original wording.
Topic description
Expected Outcome: The proposals under this topic should address the design/specification and implementation/testing of the key microelectronics building blocks of an FR3 FEM paving the way towards their future integration into a complete integrated FEM system. • Progresses the State of the art to optimise the cost-performance trade off to serve the target ITU IMT 2030 specifications, notably for what concerns maximum data rate, user data rate, spectral efficiency, whilst enabling 50% mobile transmission system energy consumption; • Allows operational implementation of spectrum sharing with other spectrum users within the selected FR3 sub-band; • Enables large arrays integration for increased path loss compensation at FR3 frequencies with very compact, low power, high efficiency FEM integration; • Enables high bandwidth for carrier aggregation with broadband RF transceivers; • Enables SBFD (Sub-Band non overlapping Full-Duplex) for UL coverage extension (Rel.-19 5G-Advanced in 3GPP) with appropriate interference cancellation techniques; • Enables ISAC (Integrated Sensing and Communications) supporting monostatic as well as bistatic radar functionality, and addressing interference management, bandwidth, and potentially different waveforms (if appropriate) for communication and sensing functions; • Builds up on core technologies and IP blocks in view of their further in package integration for the various functionalities to be implemented, including as a minimum i) computing ii) RF iii) power generation technologies: iv) beam forming technologies; • Is based on semiconductor technology development supporting at least characterised models for RF, standard cell support for compute, interconnect and memory, and supported with relevant PDK and EDA support (analog/digital). • Enables base die development for implementation of the most critical functions and subsystem integration and paves the way towards their future complete integration enabling validation in real environment (outside of this project) • Enables FEM system integration with packaging; • Allows to progress European know-how in microelectronics domains where Europe is today less advanced, notably in the field of digital technologies, and with advances at least from the design perspective; • Paves the way towards the emergence of an alternative European ecosystem of technology suppliers for FEM modules as needed by EU vendors; • Stimulates related progresses in the field of design tools, notably for Process Design Kits (PDKs). • Extent to which the project results contribute to reinforce a European ecosystem of microelectronic suppliers for the telecom industry. • Stimulates related progresses in the field of design tools, notably for Process Design Kits (PDKs). Collaboration with the relevant Pilot Lines is encouraged and a plan for further pre industrialisation of an integrated FEM SiP is part of the target outcomes.
Conditions and documents
General conditions
1. Admissibility conditions: Proposal page limit and layout
Proposal page limits and layout: detailed in Part B of the Application Form, which you can access from the Call documents section on the Chips JU website's Call page
The following information are all described in the Appendix 7 of the Chips JU Workprogramme
2. Eligible countries
3. Other Eligibility Conditions
4. Financial and operational capacity and exclusion
5a. Evaluation and award: Award criteria, scoring and thresholds
5b. Evaluation and award: Submission and evaluation processes
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
6. Legal and financial set-up of the grants
Specific conditions
Please refer to the Appendix 7 of the Chips JU Workprogramme
Please refer to the calls documents section on the Chips JU website's Call page to view and download all required documents and templates.
Specific documents
2026 Guide for Applicants RIA_IA_FT-FPP
Evaluation Form Chips IA RIA FT-FPP
Template Application form Part B IA-RIA-FT FPP
Ownership Control Declaration form template
National Budgets Table template (xls)
General documents
Chips JU Multiannual Work Programme
Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026
PAB decision on the evaluation and selection procedures related to Calls for Proposals
ECS Strategic Research and Innovation Agenda
Annotated Model Grant Agreement for EU Funding Programmes 2021-2027
Application and evaluation forms and model grant agreement (MGA):
Additional documents:
Support information
For any questions related to this call please contact: Calls@chips-ju.europa.eu Online Manual is your guide on the procedures from proposal submission to managing your grant. Horizon Europe Programme Guide contains the detailed guidance to the structure, budget and political priorities of Horizon Europe. Funding & Tenders Portal FAQ – find the answers to most frequently asked questions on submission of proposals, evaluation and grant management. Research Enquiry Service – ask questions about any aspect of European research in general and the EU Research Framework Programmes in particular. National Contact Points (NCPs) – get guidance, practical information and assistance on participation in Horizon Europe. There are also NCPs in many non-EU and non-associated countries (‘third-countries’). Enterprise Europe Network – contact your EEN national contact for advice to businesses with special focus on SMEs. The support includes guidance on the EU research funding. IT Helpdesk – contact the Funding & Tenders Portal IT helpdesk for questions such as forgotten passwords, access rights and roles, technical aspects of submission of proposals, etc. European IPR Helpdesk assists you on intellectual property issues. CEN-CENELEC Research Helpdesk and ETSI Research Helpdesk – the European Standards Organisations advise you how to tackle standardisation in your project proposal. The European Charter for Researchers and the Code of Conduct for their recruitment – consult the general principles and requirements specifying the roles, responsibilities and entitlements of researchers, employers and funders of researchers. Partner Search help you find a partner organisation for your proposal.
Raw budget overview
{
"budgetYearsColumns": [
"2026"
],
"budgetTopicActionMap": {
"115282": [
{
"action": "HORIZON-JU-CHIPS-2026-2-RIA - HORIZON-JU-RIA HORIZON JU Research and Innovation Actions",
"expectedGrants": 1,
"minContribution": 1000000,
"maxContribution": 20000000,
"budgetYearMap": {
"2026": "20000000"
},
"plannedOpeningDate": "2026-07-07",
"deadlineModel": "single-stage",
"deadlineDates": [
"2026-09-16"
]
}
]
}
}